Metal Sputtering Target

Ruthenium sputtering targets are grey targets composed of high purity ruthenium metal. Melting point 2334°C, density 12.37, thermal expansion 6.4 µm/(m·K). 

Ruthenium sputtering targets are available in various forms, purities, sizes and prices. We are able to provide custom sputtering materials based on any specifications/

drawings you provide to us.

Ruthenium Target Preparation Process

Material Preparation - Sintering - Annealing - Rolling - Stamping - Metallographic Inspection - Machining - Dimensional Inspection - Cleaning - Inspection - Packaging

Ruthenium target preparation method

Cold-press ruthenium powder with a particle size of ≤325 mesh, with a cold pressing pressure of 250-350MPa to obtain a ruthenium blank; vacuum the ruthenium 

blank to 0.008-0.12Pa, heat it to 790-820℃ at 10-20℃/min, keep it warm for 30-50min, then heat it to the first temperature at 5-10℃/min and press it, with a press pressure 

of 50-70MPa; continue to heat it to the second temperature, keep it warm for 120-180min; the first temperature is 1000-1200℃, and the second temperature is 1200-1350℃;

then cool it to 1000-1100℃ at 5-8℃/min, keep it warm for 55-65min, and obtain a ruthenium sputtering target.

Advantages of Ruthenium Targets

Chemical resistance, drop resistance, ultra-wear resistance, high temperature resistance, anti-static, fire resistance

Applications of Ruthenium Sputtering Targets

Ruthenium sputtering targets are used to produce pure ruthenium films on substrates, which have shown encouraging performance in microchips.

Other applications of ruthenium include:

Used in the electronics industry to make electrical contacts and chip resistors

Used as anodes for chlorine production in electrochemical cells in the chemical industry.

Used as a hardener and multifunctional catalyst for platinum and palladium to remove H2S from refineries and other industrial processes.